SMT Assembly Line, mounter+ printer+reflow oven for PCB prototype in EU/ USA

Description

Recommend!
SMT PCB Assembly Line: NeoDen4 pick and place machine+ IN6 reflow oven+ FP2636 stencil printer (tariff, tax, local cost not included)
Details including:
1) NeoDen4 with internal conveyor version+ 30*8mm, 5*12mm, 1*24mm feeders+ monitor+ stand; CE approved from TUV Nord
2) IN6 Reflow oven+ IN6 stand; CE approved from TUV Nord
3) FP2636-frameless type Stencil printer for solder pasting
Items technical parameter:
NeoDen4 pick and place machine
Number of Heads with Vision enabled:4
Placement Rate: 4000PCS/H (vision on)
Feeder Capacity:Tape Reel Feeders:48
Tape width: 8mm,12mm,16mm,24mm
Vibration Feeders:5
IC Tray Capacity:5
Component sizes with vision:Smallest Component  size:0201  Largest Component size:TQFP240
Applicable Components:0201,BGA,SOIC,SSOP,QFN,TQFP,Led Component,Diode,Triode,Tack Switch
Component Height Maximum:5mm
Resolution X/Y axis:0.01mm   Z axis:0.1mm
Rotation:+/-180(360)
Positioning Accuracy:+/-0.02mm
X-Y repeatability:+/-0.02mm
Applicable PCB area:310mm*1500mm
Placement Area:310*1500mm(without waffle Tray)    140*1500mm(With 1 waffle Tray)
Main Control:GUI
Power Supply:220V, 50Hz(convertible to 110V）
Power:180W
External Dimensions:Machine:87*68*48CM
Packing size:94*74*60CM
Net Weight:60KGS
Gross weight:80Kgs
IN6 reflow oven
Power requirement
110/220VAC 1-phase
Power max.
2KW
Heating zone quantity
upper3/down3
Conveyor speed
15 - 60 cm/min (6 – 23 inch/min)
Standard Max Height
30mm
Temperature control range
Room temperature
～
300 degree celsius
Temperature control accuracy
±0.2 degree celsius
Temperature distribution deviation
±1 degree celsius
Soldering width
260 mm (10 inch)
Length process chamber
680 mm (26.8 inch)
Heat-up time
approx. 15 min
Dimensions
1020 x 507 x 350 mm (L x W x H)
Packing Size
112x 62x 74cm (with table)
N.W.
106KG
FP2636-frameless solder printer
Used for the PCB screen printing.
Frameless!
Your stencil just be a thin metal sheet will be available!
Save much space in your lab.
Traditional frame must with an outside frame which will cost stocking space much bigger.
Max. pcb size
280*380mm
Min. pcb size
10*5mm
Pringting area
260*360mm
PCB thickness
0-20mm
Positioning pin size
1mm/1.5mm/2.0mm/2.5mm/3mm
Repeatability
+/-0.1mm
Platform height
190mm
N.W./G.W.
12/14kg
Fine adjustment range
Z-axis:+/-15mm
X-axis:+/-15mm
Y-axis:+/-15mm
Max. rotation angle
+/-15 angle
Application:
SMT assembly prototyping in labs, universities, personal engineering etc.
Notice:
Reflow oven and solder paste printer can be replaced by other models like T5/ T8/ frameless printer etc. Prices will be changed accordingly.